Pankaj,

Seleo CP is a direct plating process where conductive polymer is deposited
in the hole walls and then the panels are electro plated to add the copper
in the non-conductive hole wall. The difference being conventional
electroless copper does this chemically by added a SnPd in the hole wall and
then chemically adds copper electrolessly. Direct plating is becoming widely
accepted for reliability and the only concern would be the same as with any
new process and that is your vendors learning curve.

Hope that this helps

Scott Westheimer
Colonial Circuits
----- Original Message -----
From: "Karnwal, Pankaj" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Sunday, January 18, 2004 10:55 PM
Subject: [TN] Celeco CP Direct plating process


>         Dear Techneters
>         We have received a communication from our local PCB supplier about
> change in Electro-Less Copper plating process to a new process "Celeco CP
> Direct plating process from Atotech"
>
>       Can anybody tell me that what is the difference between and, is it
the
> new process  better, any  risk factor
> to adopt this technology. Any experience ???
>
> Pankaj Karnwal
> Jr. Engineer QA
>
> Barco Electronics System  (P) Ltd.
> Plot no. A - 4 & 5, Sector- 5
> G.B Nagar, Noida  - 201301
> India
> Fax.+91-120-2421691
> mailto:[log in to unmask]
>
>
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