Pankaj, Seleo CP is a direct plating process where conductive polymer is deposited in the hole walls and then the panels are electro plated to add the copper in the non-conductive hole wall. The difference being conventional electroless copper does this chemically by added a SnPd in the hole wall and then chemically adds copper electrolessly. Direct plating is becoming widely accepted for reliability and the only concern would be the same as with any new process and that is your vendors learning curve. Hope that this helps Scott Westheimer Colonial Circuits ----- Original Message ----- From: "Karnwal, Pankaj" <[log in to unmask]> To: <[log in to unmask]> Sent: Sunday, January 18, 2004 10:55 PM Subject: [TN] Celeco CP Direct plating process > Dear Techneters > We have received a communication from our local PCB supplier about > change in Electro-Less Copper plating process to a new process "Celeco CP > Direct plating process from Atotech" > > Can anybody tell me that what is the difference between and, is it the > new process better, any risk factor > to adopt this technology. Any experience ??? > > Pankaj Karnwal > Jr. Engineer QA > > Barco Electronics System (P) Ltd. > Plot no. A - 4 & 5, Sector- 5 > G.B Nagar, Noida - 201301 > India > Fax.+91-120-2421691 > mailto:[log in to unmask] > > > --------------------------------------------------- > Technet Mail List provided as a service by IPC using LISTSERV 1.8e > To unsubscribe, send a message to [log in to unmask] with following text in > the BODY (NOT the subject field): SIGNOFF Technet > To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) > To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest > Search the archives of previous posts at: http://listserv.ipc.org/archives > Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 > ----------------------------------------------------- > --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 -----------------------------------------------------