Hi Vladimir! I recommend you look over the Journal of Electronic Materials
article abstracts - lots of good data with some fracture toughness studies
(especially during the 2001-2004 period). Good Luck.
Dave Hillman
Rockwell Collins
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Vladimir Igoshev
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> cc:
Sent by: TechNet Subject: [TN] Fracture toughness of ENIG interface
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01/30/2004 10:15
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Vladimir Igoshev
Hi everybody,
I'm looking for information on the fracture toughness of the solder/solder
pad interface after soldering to EHIG finished pads. So far I have found
just one or two relevant references and would appreciate any additional
information.
Thanks a lot in advance.
Regards,
Vladimir Igoshev
Research in Motion
Voice: (+1) 519-888-7465, ext. 5283
Fax: (+1) 519-886-0863
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