Hi Vladimir! I recommend you look over the Journal of Electronic Materials article abstracts - lots of good data with some fracture toughness studies (especially during the 2001-2004 period). Good Luck. Dave Hillman Rockwell Collins [log in to unmask] Vladimir Igoshev <[log in to unmask] To: [log in to unmask] > cc: Sent by: TechNet Subject: [TN] Fracture toughness of ENIG interface <[log in to unmask]> 01/30/2004 10:15 AM Please respond to "TechNet E-Mail Forum."; Please respond to Vladimir Igoshev Hi everybody, I'm looking for information on the fracture toughness of the solder/solder pad interface after soldering to EHIG finished pads. So far I have found just one or two relevant references and would appreciate any additional information. Thanks a lot in advance. Regards, Vladimir Igoshev Research in Motion Voice: (+1) 519-888-7465, ext. 5283 Fax: (+1) 519-886-0863 E-mail: [log in to unmask] <mailto:[log in to unmask]> --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 -----------------------------------------------------