In a message dated 1/26/2004 1:01:09 PM US Eastern Standard Time,
[log in to unmask] writes:
I know that 0402 is a mature technology. I am getting ready to do a board
which will use all 0402 passives. I have very little experience with 0402.
From what I have been reading it seems very important that components go
through the oven broadside so that both sides go liquidous at the same time.
There is an alternative. Multicore offers a solder paste that is
"Anti-tombstoning" and has been written up in a couple of articles for the magazines.
The staged reflow of the two alloys in the powder would greatly reduce the
problems you describe.
Jon Moore
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