In a message dated 1/26/2004 1:01:09 PM US Eastern Standard Time, [log in to unmask] writes: I know that 0402 is a mature technology. I am getting ready to do a board which will use all 0402 passives. I have very little experience with 0402. From what I have been reading it seems very important that components go through the oven broadside so that both sides go liquidous at the same time. There is an alternative. Multicore offers a solder paste that is "Anti-tombstoning" and has been written up in a couple of articles for the magazines. The staged reflow of the two alloys in the powder would greatly reduce the problems you describe. Jon Moore --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 -----------------------------------------------------