Hi Douglas,

Depending on the type of lead-termination I'd be very worried about
degradation of solderability. The high temperature will speed up
oxidation and intermetallic growth.
As for reliability of the IC itself I can only guess that this type of
storage shouldn't be a problem, as the operational temperature of the IC
after assembly will probably be even higher.

Daan Terstegge
Thales Communications
Unclassified mail
Personal Website: http://www.smtinfo.net


>>> [log in to unmask] 10/13/03 11:47am >>>
Hi to all,

From an IC device reliability point of view, does anyone know whether
it is
possible to store say J-STD-020B class-3 devices in a storage oven at
a
possibly
60 Deg-C for an un-limited (within reason) period to save re-sealing
(shrink-wrapping)
the trays/devices.

I guess this is similar to using a storage-cabinet but would eliminate
the
requirement to actually re-seal the bags.

Any thoughts ??

> Thanks,
> Douglas I McCall
> Printed Circuit Board Assembly Engineer,
>
> /// /// ///  BOC EDWARDS
H   BOC Edwards, 15 Marshall Road, Eastbourne, East Sussex, England,
BN22
9BA
> *  +44 (0)1323 501147
*    +44(0)1323 509824
*+44 (0)7785 247 685
> *  mailto:[log in to unmask]
>
>

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