Hi Douglas, Depending on the type of lead-termination I'd be very worried about degradation of solderability. The high temperature will speed up oxidation and intermetallic growth. As for reliability of the IC itself I can only guess that this type of storage shouldn't be a problem, as the operational temperature of the IC after assembly will probably be even higher. Daan Terstegge Thales Communications Unclassified mail Personal Website: http://www.smtinfo.net >>> [log in to unmask] 10/13/03 11:47am >>> Hi to all, From an IC device reliability point of view, does anyone know whether it is possible to store say J-STD-020B class-3 devices in a storage oven at a possibly 60 Deg-C for an un-limited (within reason) period to save re-sealing (shrink-wrapping) the trays/devices. I guess this is similar to using a storage-cabinet but would eliminate the requirement to actually re-seal the bags. Any thoughts ?? > Thanks, > Douglas I McCall > Printed Circuit Board Assembly Engineer, > > /// /// /// BOC EDWARDS H BOC Edwards, 15 Marshall Road, Eastbourne, East Sussex, England, BN22 9BA > * +44 (0)1323 501147 * +44(0)1323 509824 *+44 (0)7785 247 685 > * mailto:[log in to unmask] > > _____________________________________________________________________ This e-mail has been scanned for viruses by MCI's Internet Managed Scanning Services - powered by MessageLabs. For further information visit http://www.mci.com --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 -----------------------------------------------------