Are you sure it is not a die change that just fails the spec limits of the ICT? What type of test is it failing?

Blair Hogg

>>> [log in to unmask] 07/24/03 01:36PM >>>
Hi all!

We've been building an assembly here for quite a while, and just recently
experienced quite a bit of failures at ICT with one IC. Out of 50 assemblies,
only 3 passed. The failures on the rest of them have been with one IC at the same
location.

I've x-ray'ed the failed parts and don't seen any broken or missing wire
bonds, so I wanted to take a look at the die area to see if I could spot something
obvious.

-Steve Gregory-






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