'Netters,

This is a question for Class 3 manufacturers,

What guidelines are followed when electronic parts need to be removed from a
circuit board?

Can you remove and re-solder a diode, capacitor or IC from a circuit board
if the error is caught prior to test?
Can a QFP or any surface mount part be lifted, reoriented and re-soldered?

What text or reference can be cited as guide or policy recommendation?

Thanks to all who can respond.

Bill Kasprzak
Moog Inc, Electronics Process Engineering

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