'Netters, This is a question for Class 3 manufacturers, What guidelines are followed when electronic parts need to be removed from a circuit board? Can you remove and re-solder a diode, capacitor or IC from a circuit board if the error is caught prior to test? Can a QFP or any surface mount part be lifted, reoriented and re-soldered? What text or reference can be cited as guide or policy recommendation? Thanks to all who can respond. Bill Kasprzak Moog Inc, Electronics Process Engineering --------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/html/forum.htm for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 -----------------------------------------------------