Content-type: |
text/plain; charset=us-ascii |
Sender: |
|
Subject: |
|
From: |
|
Date: |
Tue, 17 Jun 2003 07:25:58 +0300 |
MIME-Version: |
1.0 |
X-To: |
|
Reply-To: |
|
Parts/Attachments: |
|
|
Good design of thermal pads is a key player in such PCBs.
ROKAH Reuven
Werner
Engelmaier To: [log in to unmask]
<[log in to unmask] cc:
COM> Subject: Re: [TN] High heat sink board hand soldering
Sent by: TechNet
<TechNet@LISTSER
V.IPC.ORG>
16/06/03 07:19
PM
Please respond
to "TechNet
E-Mail Forum.";
Please respond
to Engelmaier
Nee how Don,
1. I would preheat even higher, 110 to 115C, measured on the board.
2. I take it you talk surface pad, are your internal pads thermal-pad
designs?
3. If you have good Cu plating and no further soldering operations, and no
severe temperature cycling [in test or operation] 25 to 50% fill should be
o.k.
Regards,
Werner Engelmaier
---------------------------------------------------
Technet Mail List provided as a free service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/html/forum.htm for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700
ext.5315
-----------------------------------------------------
---------------------------------------------------
Technet Mail List provided as a free service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/html/forum.htm for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
-----------------------------------------------------
|
|
|