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April 2003

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Subject:
From:
"Jason W. Gregory" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 1 Apr 2003 16:33:53 -0600
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Carl,

why don't you build an inexpensive SS plate with equal-length standoffs at
the corners (preferably under tooling holes) and then you can lay the
assembly on it and detect if any corner is lifted.



Jason Gregory
SMT Production Supervisor/
Integrated Product Team Leader
LaBarge Inc.
(918)459-2367
(918)459-2221 fax
[log in to unmask]
http://www.labarge.com



                      Carlr Ray
                      <Carlr.Ray@SANMIN        To:       [log in to unmask]
                      A-SCI.COM>               cc:
                      Sent by: TechNet         Subject:  [TN] Board warpage
                      <[log in to unmask]>


                      04/01/03 04:14 PM
                      Please respond to
                      "TechNet E-Mail
                      Forum."; Please
                      respond to Carlr
                      Ray






 Any of you guys know how to measure board warpage after the unit has been
completely process?

Process:
SMT Bottom
SMT Top
PTH Axial and Radial
Hand loaded
Wave Solder
Post wave processing

 At my Incoming receiving area I can detect board warpage but after the
wave process (sometimes SMT Top) the boards start to warp. All the profiles
have been verified and validated.
 We know we have a vender issue but the problem is our customer will not
accept the unit we have in process (around 500). So if anyone has any
suggestions it would be greatly appreciated.

Carl Ray
Sr. Manufacturing Engineer
Huntsville, AL 35807
Phone: 256-882-4800 ext. 8845
Cell: 256-990-1990

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