I agree with Phil and Peter, wholeheartedly. If the prepreg is a lo-flo
or no-flo type or if it has a low resin content (frequent with 7nnn
styles) or if the copper is thick or any combination of these, then you
are making a build-up which will be weakest exactly where you drill the
holes. The result will be ripe for many ills, and is a frequent
precursor to conductive anodic filaments (CAFs). With the copper in
place on every layer, you will have a nice, compact build-up.

Been there, done that!

Brian

Bill Decray wrote:
> Hello fellow TechNet Guru
> Does anyone have or know off any specifications that talk about removal of
> non functional pads and what effects it has on a finished circuit boards if
> any
>
>
>
> Highest Regards,
>
> William W. DeCray III
> Waytec Electronics Corp
> Engineering Services Manager
> PHONE:(434) 237-6391 ext 115
> CELL:   (434) 851-6115
> FAX:    (434) 237-1324
> E-mail:<[log in to unmask]>
> Web http://www.waytec.com
> FTP  ftp://ftp.waytec.com
>
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