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Hi Randy! Any component that has been adequately/correctly tinned should be
able to meet the solderability requirements of JSTD-002B. I recommend you
take a sample of the "dip-n-spin" components and conduct a solderability
test per the 002B specification. If the "dip-n-spin" process is resulting
in too thin of solder coverage I would imagine that the steam conditioning
step of the 002B solderability test will cause enough oxidation that the
components will fail the test requirements. Having too thin of a solderable
coating which in turn allows for oxidation of a component's lead base metal
is a classic cause of solderability problems. Good Luck.
Dave Hillman
Rockwell Collins
[log in to unmask]
"Mummert, Randy"
<randy.mummert@BO To: [log in to unmask]
EING.COM> cc:
Sent by: TechNet Subject: [TN] Tinning requirements
<[log in to unmask]>
03/12/2003 04:22
PM
Please respond to
"TechNet E-Mail
Forum."; Please
respond to
"Mummert, Randy"
Hello all,
I need to find requirements which specify lead tinning requirements.
We have a supplier which is performing a lead tinning process called
"DIP-N-SPIN". Is anyone using this process? The device is dipped and then
spun at 2000RPM. This process leaves a very thin layer of tin/lead on the
leads. Measured data shows 20micro-inches, this is over Kovar leads. Seems
I remember 300 micro-inches from some document. We're having problems with
solderability and fractured solder joints. IPC or MIL standards would be
great.
Thanks in advance,
Randy
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