TECHNET Archives

February 2003

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Reply To:
Date:
Thu, 27 Feb 2003 08:46:01 -0500
Content-Type:
text/plain
Parts/Attachments:
text/plain (78 lines)
Daan,
I used my in-house equipment (our own) of IR curing station as rework
station.  It works very well with bottom side pre-heat controlled at
120-130 C.  Focus IR is the way to go.  Peter and Steve can tell you
more about PDR system.  Because the IR spot is focused on top of the
chip device, little or no effect on the small de-couple cap in the area.
For high speed assembly, if you use hot air reflow, you may have to
re-work or remove the de-couple caps to make room for the nozzle to come
down (or lost some hot air due to the gap... In the re-work process, you
may reflowed cap too due to the close proximity of the parts related to
the chip device).  It is particularly good for HDI type of the assembly,
HDI usually have jam packed everything single sided (e.g. automotive
mounting parts, cell phone assembly, MEMS, Optoelectronic assembly, MCM,
etc.etc.).
Good luck.
                                jk
>-----Original Message-----
>From: TechNet [mailto:[log in to unmask]] On Behalf Of d. terstegge
>Sent: Wednesday, February 26, 2003 11:31 AM
>To: [log in to unmask]
>Subject: [TN] BGA rework equipment
>
>
>Hi Technet,
>
>We're planning to replace our current BGA repair equipment by
>something that's more suitable for fine-pitch BGA's and
>microBGA's (ballpitches down to 0.5 mm). We can get a brandnew
>Airvac DRS24 (or Zevac, as it's called in Europe) for half the
>price, but then we need to decide about it very soon, without
>having the time to do a good evaluation. Time to seek some
>expert's advice.....
>
>A significant part of our production work is subcontracting,
>and new customer-relations often start with doing some
>BGA-repairs for them. It's always urgent (no time to order a
>nozzle), there's never a sample board to adjust the profile,
>and normally there's hardly any free area around the BGA. We
>see everything from fine-pitch BGA's to CBGA's, 40*40 mm
>heatsinked-BGA's and BGA-sockets, on boardthicknesses up to 5
>mm. From what I heard the Airvac is certainly one of the very
>best rework-machines on the market, but I'm not sure if it is
>the best choice (i.e. flexible enough) for our situation.
>
>Any recommendations ?
>
>Daan Terstegge
>Thales Communications
>Unclassified mail
>Personal Website: http://www.smtinfo.net
>
>---------------------------------------------------
>Technet Mail List provided as a free service by IPC using
>LISTSERV 1.8e To unsubscribe, send a message to
>[log in to unmask] with following text in the BODY (NOT the
>subject field): SIGNOFF Technet To temporarily halt or
>(re-start) delivery of Technet send e-mail to
>[log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE
>mailing per day of all the posts: send e-mail to
>[log in to unmask]: SET Technet Digest Search the archives of
>previous posts at: http://listserv.ipc.org/archives Please
>visit IPC web site http://www.ipc.org/html/forum.htm for
>additional information, or contact Keach Sasamori at
>[log in to unmask] or 847-509-9700 ext.5315
>-----------------------------------------------------
>

---------------------------------------------------
Technet Mail List provided as a free service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/html/forum.htm for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
-----------------------------------------------------

ATOM RSS1 RSS2