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February 2003

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From:
"d. terstegge" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 26 Feb 2003 17:30:47 +0100
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Hi Technet,

We're planning to replace our current BGA repair equipment by something
that's more suitable for fine-pitch BGA's and microBGA's (ballpitches
down to 0.5 mm).
We can get a brandnew Airvac DRS24 (or Zevac, as it's called in Europe)
for half the price, but then we need to decide about it very soon,
without having the time to do a good evaluation.
Time to seek some expert's advice.....

A significant part of our production work is subcontracting, and new
customer-relations often start with doing some BGA-repairs for them.
It's always urgent (no time to order a nozzle), there's never a sample
board to adjust the profile, and normally there's hardly any free area
around the BGA. We see everything from fine-pitch BGA's to CBGA's, 40*40
mm heatsinked-BGA's and BGA-sockets, on boardthicknesses up to 5 mm.
From what I heard the Airvac is certainly one of the very best
rework-machines on the market, but I'm not sure if it is the best choice
(i.e. flexible enough) for our situation.

Any recommendations ?

Daan Terstegge
Thales Communications
Unclassified mail
Personal Website: http://www.smtinfo.net

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