At 03:29 PM 1/28/2003 -0800, Roger Mouton wrote:
>Mr. Mattix,
>
>I appreciate your recent TechNet post re: via plugging. Thanks. I'm
>interested in knowing more about how your suppliers get the non-conductive
>fill materials to better accept electroplating.
I think it mostly improvements/changes in the fill material helping accept
the plating. I think some might do additional permanganate or plasma
processing. The best adhesion I've seen was with where they used DMS-E
direct metallization in place of conventional electroless.
> Thanks again for your post.
>
>Roger Mouton
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