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January 2003

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Subject:
From:
Guenter Grossmann <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 29 Jan 2003 09:00:02 +0100
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Bill

No need to change your process in any way.
I wouldn't know of any negative influence on solder joint reliability
There are component manufacturers (Murata, BC-Components) that use pure tin since many years and we hat lots of them here for analysis. I have never heard any problem from our partners from industry about whiskers during storage.

Best regards

Guenter

EMPA
Swiss Federal Institute for Materials Testing and Research
Centre for Reliability
Guenter Grossmann,  Senior Engineer

8600 Duebendorf
Switzerland

Phone: xx41 1 823 4279
Fax :     xx41 1823 4054
mail:     [log in to unmask]

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