Obviously, I should clarify.....the 5DX will not identify these cracks
during normal testing and call them out as failures. Using the machine in
real-time and knowing what area of balls to look in is where this occurs. I
found anomalies that leaned toward solder joint cracking. Using the image
capture, and, ultimately, replacing the suspect BGA fixed the board and
returned it to service. It should be noted that the main problem occured
during testing and placing pressure on the suspect BGA made it pass and
releasing let if fail.

Jason Gregory




Werner Engelmaier <[log in to unmask]>@ipc.org> on 01/27/2003 02:52:31 PM

Please respond to "TechNet E-Mail Forum." <[log in to unmask]>; Please respond
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Subject:    Re: [TN] BGA micro cracks


Hi Jason,
Not even Agilent makes that kind of claim for its 5DX--and I worked with
them
on this. The only X-ray system I found that could show some cracks is the
Uni-Hite XVA-160.

Werner Engelmaier

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