Besides the regular MSD's controlled by J-STD-033A (Handling, Packing,
Shipping and Use of Moisture/Reflow Sensitive SMD's), and JEDEC Moisture
Sensitivity Specification J-STD-020B (Moisture/Reflow Sensitivity
Classification)
which can be downloaded free from the JEDEC web site
http://www.jedec.org
There is a new standard from IPC called  IPC-9503 "Moisture Sensitivity
Classifications for Non-IC Components"...

It is my suspicion that some manfacturers are using the MSD process to
produce products that have been 'under qualified' (Failed normal
qualification requirements with low strength or incorrect CTE epoxy
encapsulants).
The recent addition of parts like LED's and DPAK transistors to the
moisture sensitive parts list is suprising.

Paul Signorelli

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