> We have been purchasing PCB Assemblies  from a sister plant.  Recently we
> have noticed quality issues on these assemblies and are working through
> the acceptance / rejection criteria.  The IPC manuals are a great source.
>
> Our question comes from the fact the while inspecting the assemblies to
> IPC 610 Class II  (Acceptability of Electronic Assemblies ),  we have
> noticed quality issues on the bare pcb ( not related to Assy processes )
> that are not covered by IPC 610 so we have utilized IPC 600 (
> Acceptability of Printed Boards).  We realize that typically bare board
> quality issues should be found at incoming inspection of the bare boards,
> but when they are not is it still acceptable to reject the assembly due to
> reduced trace width or other reject able criteria on the pcb in IPC 600.
> If so,   what level of magnification should be used.
> IPC 610 - allows a referee upto to 20 X magnification for a specific
> technology
> IPC 600 - allows a referee upto 40X for some criteria.
> Can 40 X be used for pcb issues unrelated to the assembly process ?
> Appreciate your inputs
>
>
>

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