Hi All,
I just rediscovered IPC-PE-740, Troubleshooting for Printed Board
Manufacture and Assembly, and Plasma Hole Preparation starts on page 91.
The subcommittee reads like a who's who of the industry including several
frequent TechNet contributors - Patricia Goldman (Chair) and Susan Mansilla.
Connie & Randy, I'll burn a ROM and bring ya copy next week. IHS is getting
me a better copy than what's currently in their system - the bloody photos
are blobs due to the scanning but it's a start.
Hans
You can run . . . but you'll only die tired.
~~~~~~~~~~~~~~~~~~~~~~~~~~~
Hans M. Hinners
AC-130 Systems Engineer (Hardware)
Warner Robins Air Logistics Center (WR-ALC)
226 Cochran Street
Robins AFB, GA 31098-1622
Tele: (478) 926 - 5847 [DSN Prefix: 468]
Fax: (478) 926 - 4911
mailto:[log in to unmask]
-----Original Message-----
From: Scott Westheimer [mailto:[log in to unmask]]
Sent: Wednesday, January 08, 2003 7:07 PM
To: [log in to unmask]
Subject: Re: [TN] Small spots on etch line
Randy,
You might want to take the cross section that the pictures came from and
perform a horizontal section to give you a better look as to if it is fibers
and there origin
Scott B. Westheimer
General Manager, Gultech North Carolina, Inc.
5800 McHines Place
Raleigh, North Carolina 27616
Phone: (919)872-0100
Fax: (919)713-4849
Toll Free: 1-866-GULTECH
Email: [log in to unmask]
http:///www.gultechna.com
----- Original Message -----
From: "Randy" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Wednesday, January 08, 2003 4:42 PM
Subject: Re: [TN] Small spots on etch line
> Thanks Susan,
> We will check this tomorrow! I'll let everyone know the out come! Right
> now we are pulling our hair out here! As a alternate supervisor of this
> shop and have never had to deal with this and uppers, wanting production.
> I'm just pull things out of the air, trying to figure this out.
>
> Thanks for all the help from everyone!
> Randy
>
> On Wed, 8 Jan 2003 16:13:24 EST, [log in to unmask] wrote:
>
> >Randy
> >Are you seeing these "spots" in the as polished condition prior to
> >microetching the mount" ? If you are, it can usually mean that there is
> >contamination there that has been plated around. That would help in
trying
> >to find out what it is.
> >
> >Another thing you can do with your process is to take your panels through
> >drill and etchback processing and then instead of going through the
> >electroless line - put them through the oxide line. The metallic areas -
> >ends of inner layers - should all darken with the oxide. If there is
resin
> >or non-metallic areas on the ends of the inner layers they won't be
coated
> >with the oxide.
> >
> >The fact that there is an indentation in the inner layer where the "ball"
> is
> >located really is a concern when trying to troubleshoot what is
happening.
> >If the glass bundles are laying on top the inner layer and are being
plated
> >around, I wouldn't expect to see the indentation - almost as though they
> have
> >been forced into the end of the inner layer.
> >
> >Susan Mansilla
> >Robisan Lab
> >
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