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January 2003

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Subject:
From:
Eric Dawson <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 17 Jan 2003 08:16:45 -0000
Content-Type:
text/plain
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Bev,
In my experience, shorting adjacent legs on an SOIC is a reliable and
effective way of making this modification. Because the legs are so close to
each other there is little relative movement so no force to disrupt the
joint.
In a similar vein, I have also developed what I call a "solder slink". This
makes a zero ohm link between adjacent pads without the aid of a zero ohm
resistor. They are formed during the normal paste/place/reflow cycle only
nothing is placed. If you need to change to the next connection, a few
seconds with an iron, some solder wick and fresh solder wire and it's done.
I can send details if anybody is interested.
My only reservation about the SOIC mod. is when a customer sees it for the
first time and thinks that a manufacturing error has occurred. As long as
the customer is happy and understands I believe it is the best way to go.
Regards
Eric Dawson

> -----Original Message-----
> From: Bev Christian [SMTP:[log in to unmask]]
> Sent: Thursday, January 16, 2003 7:01 PM
> To:   [log in to unmask]
> Subject:      [TN] Purposefully shorting two adjacent SOIC leads.
>
> Technetters,
> How do I do what is proposed in my title?  The options are using excess
> solder or using a mod wire.  Are there other options for doing this mod?
> What do people do?  What is allowed and not allowed by IPC standards (I
> couldn't find anything, but then I may not be looking in the right place.)
> I would expect option one would be a whole heck of a lot easier than
> option 2.  As long as option 1 doesn't produce bulbous joints with the
> solder all the way up to the component body is there any real reason why I
> can't do this?
>
> regards,
> Bev Christian
> Research in Motion
>
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