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January 2003

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Subject:
From:
Leland Woodall <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 2 Jan 2003 22:27:26 -0600
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Hello All,

Can anyone give me some guidance on the best way to cut down on fine pitch
component scrap?  We're trying to understand the gains and/or potential
problems of re-using expensive components that were placed on boards with
many scattered or missing discretes.  Currently we remove these from the
board and send them to the repair department for later usage.  Many of the
leads have traces of solder paste on them.

Are there any better ways to accomplish this goal?

Thanks in advance,

Leland Woodall

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