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January 2003

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Subject:
From:
Ted Kong <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 20 Jan 2003 17:32:09 -0800
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Hi Colleen,

I have built .093" thick 16"x20" boards in previous
live.  However, it was a back plan board, so the
number of surface mount components on top and bottom
was limited.  Majority are BNC connectors.  We did
have reliablity problem in the begining, so we end up
switch to high Tg FR 4 material.  After that we did
not have any issues.  The board was reflowed and wave
soldered, and we did not have any warpage issues.  You
might see no top solder if the board did not get
enough pre-heat.

Ted
--- Colleen Coccia <[log in to unmask]> wrote:
>
> Good afternoon.
>
> Does anyone have either current or past experiences
> manufacturing PWA's of approximately 15.5" x 23.7"
> with a board thickness of .093" (double-sided)?
> This may include meeting IPC-A-610 solder
> requirements, acceptable wave profiles, excessive
> warpage or handling issues which may contribute to
> higher costs (outside of the norm) for producing an
> assembly of this size.
>
> Any and all feedback would be gratefully
> appreciated!
>
> Colleen Coccia
> NPI Quality Engineer
> McDATA Corporation
>
> [log in to unmask]
> office:  720-558-3964
>
>
>
>
>
>
>
>
>
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