When looking again at the "GOOD BAD AND UGLY" you see the good is good as
programming, wire bonding, and device is perfect - almost as a little wire
bond skew appears.

Looking at bad, the skew continues way out of control. Is this a function of
wire bond program and chip bond alignment process - looks like it could be
either of a combination.

Looking at ugly, the whole wire bond process has come to a halt. Did the
wire run out and the process continued with no bonds possible?

No matter, there are serious and very basic issues with process control at
this supplier. Not subjectively, but VERY OBJECTIVELY, this supplier hasn't
a leg to stand on.

MoonMan

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