When looking again at the "GOOD BAD AND UGLY" you see the good is good as programming, wire bonding, and device is perfect - almost as a little wire bond skew appears. Looking at bad, the skew continues way out of control. Is this a function of wire bond program and chip bond alignment process - looks like it could be either of a combination. Looking at ugly, the whole wire bond process has come to a halt. Did the wire run out and the process continued with no bonds possible? No matter, there are serious and very basic issues with process control at this supplier. Not subjectively, but VERY OBJECTIVELY, this supplier hasn't a leg to stand on. MoonMan --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/html/forum.htm for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------