0805's are definitely the preferred option for SM bottom side. The 1206's are being
ramped down by suppliers and you may have difficulty in obtaining the vaules required.
You have to remember that different SM pads sizes are required when reflowing using
a wave solder machine as opposed to a reflow oven.
If your SM glue machine has difficulty with this then you can screen print the glue more
accurately.
On 21 Aug 2002 at 17:30, WEEKES, MICHAEL HS-SNS wrote:
Date sent: Wed, 21 Aug 2002 17:30:30 -0400
Send reply to: "TechNet E-Mail Forum." <[log in to unmask]>,
"WEEKES, MICHAEL HS-SNS" <[log in to unmask]>
From: "WEEKES, MICHAEL HS-SNS" <[log in to unmask]>
Subject: Re: [TN] Bottom side SMT passives
Originally to: Paul Truit <[log in to unmask]>
To: [log in to unmask]
> There are many different competing objectives here. I would consider your
> glue dispenser's capability to place 0603 dots. Typically 0805 is the
> optimal solution, assuming the suppliers of passives are slowly ramping down
> in 1206s and toward 0805. I think some packages are not available yet in
> the 0603. It all depends what passives you're using. Another question is
> whether double sided reflow is an option, making 0603s much easier to
> solder. This assumes also you have a relatively new placement machine -
> older ones will not handle 0603 with any cost-effective drop-rate.
>
> Mike
>
> -----Original Message-----
> From: Paul Truit [mailto:[log in to unmask]]
> Sent: Wednesday, August 21, 2002 3:14 PM
> To: [log in to unmask]
> Subject: [TN] Bottom side SMT passives
>
>
> What is the "preferred" size package of choice for wave soldering
> passives when board space in design layout forces the passives to the
> bottom side but the component count and lines/width spacing requirements
> are not tight?
>
> A: 1206
> B: 0805
> C: 0603
> D: doesn't really matter my yield is best for any type
>
> I have my preference but just wanted to see how others feel in regard to
> this type of situation.
> --
> Paul Truit, Mfg. Eng.
> RBB Systems, Inc.
> 4265C E. Lincolnway
> Wooster, OH 44691
> Ph. (330) 567-2906 ext 514
> Fax (330) 263-5324
> Email: [log in to unmask]
>
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Best Regards
Gordon McAlpine
Test Engineering Manager
Telspec Scotland Ltd
Tel :- 01738 494500
DDI :- 01738 494506
Fax :- 01738-630012
E-Mail :- [log in to unmask]
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