Paul,

Given that spacing requirements are not tight, I would prefer 1206, then
0805, then 0603 last to reduce the degree of difficulty of adhesive
dispensing (or printing) and minimize solder defects (note there may be cost
and availability issues with 1206 size components).  Attention to DFM
details such as component orientation through the wave and pad design is
essential as you reduce component size.  Would double-sided reflow with a
selective wave solder process (either via selective solder fixtures or
selective soldering system) be an option to avoid SMT wave soldering?

Howard A. Cyker
Lucent Technologies
Engineering Infrastructure - New Product Engineering
        Email [log in to unmask]
        Phone 978-960-2964


-----Original Message-----
From: Paul Truit [mailto:[log in to unmask]]
Sent: Wednesday, August 21, 2002 4:14 PM
To: [log in to unmask]
Subject: [TN] Bottom side SMT passives


What is the "preferred" size package of choice for wave soldering
passives when board space in design layout forces the passives to the
bottom side but the component count and lines/width spacing requirements
are not tight?

A: 1206
B: 0805
C: 0603
D: doesn't really matter my yield is best for any type

I have my preference but just wanted to see how others feel in regard to
this type of situation.
--
Paul Truit, Mfg. Eng.
RBB Systems, Inc.
4265C E. Lincolnway
Wooster, OH  44691
Ph. (330) 567-2906 ext 514
Fax (330) 263-5324
Email: [log in to unmask]

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