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Reply To: | TechNet E-Mail Forum. |
Date: | Thu, 8 Aug 2002 15:15:56 -0400 |
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Bev,
There is nothing wrong with the Dip-&-Look test it's simple and you get about as much information as you get from any other test. However, we rely on JSTD-002A Test S Surface Mount Process Simulation Test for RF shields. There is nothing better to test the solderability of a part than the actual process you're using for assembly of product.
Regards,
George
George M. Wenger (908)-546-4531
Reliability Engineer
RF Power Amplifier Group
Andrew Corporation, 40 Technology Drive, NJ 07059
[log in to unmask]
-----Original Message-----
From: Bev Christian [mailto:[log in to unmask]]
Sent: Thursday, August 08, 2002 1:03 PM
To: [log in to unmask]
Subject: [TN] Solderability Testing of RF Shields
TechNetters,
I would appreciate any advice you can give on how I should test these things
for solderability. They are BIG (relative to SOIC20's or 0402's) and have a
high thermal mass. We have tried using a globule block and a solder bath
with different physical orientations, dips times, etc., but have not been
able to come up with a good set of parameters for doing this. Any
suggestions, short of the old "dip and look" of the mil standard?
regards,
Bev Christian
Research in Motion
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