Hi,

Is there anyone experience in handling WQFN component.
This type of component is from NEC. I am not able to find
out much about this type of package.

I am seeing abnormal solder fillet formation. The fillet is
not smooth joint, but rather showed to be 'dewet' ?

I hope someone who has experience in assembling this
component, can share his or her experience, such as
what type of reflow temperature, solderpaste type,
he/she is using, and how the fillet formation should look
like.

Thanks.

Poh

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