Hi, Is there anyone experience in handling WQFN component. This type of component is from NEC. I am not able to find out much about this type of package. I am seeing abnormal solder fillet formation. The fillet is not smooth joint, but rather showed to be 'dewet' ? I hope someone who has experience in assembling this component, can share his or her experience, such as what type of reflow temperature, solderpaste type, he/she is using, and how the fillet formation should look like. Thanks. Poh --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/html/forum.htm for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------