Hi Henry! I don't have any specific data on the interaction of
intermetallic growth and solder joint failures other than it is generally
acknowledged that "thick" intermetallics will cause solder joint failures.
I have experience with the reworking of a component between 1-3 times
(using standard/typically semiautomated rework equipment, profiles and
soldering times) and not had any issue with intermetallic phase induced
solder joint failures in high performance product use environment. Take a
look in KleinWassink's book (ISBN 0-901150-14-2), page 95 - there is a
temperature versus time versus intermetallic thickness chart which you can
use to get an idea of how much intermetallic you will create depending on
your soldering process. Good Luck.
Dave Hillman
Rockwell Collins
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Henry Rekers <[log in to unmask]>@ipc.org> on 06/11/2002 04:05:28 PM
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Subject: [TN] Intermetallic Joint Failure
Does anybody have any data or standards on the amount of times a solder
joint can be re-flowed regarding intermetallic growth and subsequent joint
failure?
We are trying to develop a "rework policy" for a high reliability product.
Our boards are fairly expensive so the trash can is not really an option
unless absolutely necessary.
Thanks.
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