Hi Henry! I don't have any specific data on the interaction of intermetallic growth and solder joint failures other than it is generally acknowledged that "thick" intermetallics will cause solder joint failures. I have experience with the reworking of a component between 1-3 times (using standard/typically semiautomated rework equipment, profiles and soldering times) and not had any issue with intermetallic phase induced solder joint failures in high performance product use environment. Take a look in KleinWassink's book (ISBN 0-901150-14-2), page 95 - there is a temperature versus time versus intermetallic thickness chart which you can use to get an idea of how much intermetallic you will create depending on your soldering process. Good Luck. Dave Hillman Rockwell Collins [log in to unmask] Henry Rekers <[log in to unmask]>@ipc.org> on 06/11/2002 04:05:28 PM Please respond to "TechNet E-Mail Forum." <[log in to unmask]>; Please respond to Henry Rekers <[log in to unmask]> Sent by: TechNet <[log in to unmask]> To: [log in to unmask] cc: Subject: [TN] Intermetallic Joint Failure Does anybody have any data or standards on the amount of times a solder joint can be re-flowed regarding intermetallic growth and subsequent joint failure? We are trying to develop a "rework policy" for a high reliability product. Our boards are fairly expensive so the trash can is not really an option unless absolutely necessary. Thanks. --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/html/forum.htm for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 --------------------------------------------------------------------------------- --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/html/forum.htm for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------