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June 2002

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TechNet <[log in to unmask]>
Subject:
Wrappage Percentage for printed boards with BGA and micro BGA
From:
Ong Seet Leng <[log in to unmask]>
Date:
Wed, 26 Jun 2002 18:23:42 +0800
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1.0
Organization:
DSO National Laboratories
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"TechNet E-Mail Forum." <[log in to unmask]>, Ong Seet Leng <[log in to unmask]>
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