Hi, can someone guide me? In IPC-A-600F (2.11) it is stated as for printed boards using surface mount components, the bow and twist shall be 0.75% or less. For all other boards, bow and twist shall be 1.50% or less. 1. What I want to know is does the 0.75% include printed boards with BGAs and micro BGAs? 2. If not, what is the bow and twist specification for boards with BGA and micro BGA and from which IPC specifications that I will be able to find them. I had briefly gone through IPC-7095 for BGAs as well as IPC-A-600F but failed to locate any. NOTE: My company is using 1% of board length for bow and twist for printed boards with surface mount components (BGAs and micro BGA included) & plated through-holes type. Regards Seet Leng