Thanks everybody for the input.
Now it's clear to me that mild flux no-clean waving after 2 reflows won't
exactly be successful with ImSn.
Regards,
Ioan
> -----Original Message-----
> From: Steve Kelly [SMTP:[log in to unmask]]
> Sent: Thursday, June 20, 2002 9:24 AM
> To: [log in to unmask]
> Subject: Re: [TN] Immersion Tin
>
> 1) we send samples to our chemistry supplier every 3 months to run the
> SERA
> 2) tight control of the chemistry on the line - actually not very
> difficult
> 3) after 5 years of running this I can look at the finish and tell with
> probably a 99.9% accuracy if it is acceptable
> 4) we also do solderability tests
> 5) 5 years of 0 field returns
>
> Regards, Steve Kelly
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of tony steinke
> Sent: Wednesday, June 19, 2002 6:12 PM
> To: [log in to unmask]
> Subject: Re: [TN] Immersion Tin
>
> Steve,
> If you do not prefer the SERA testing to measure/evaluate
> the amount of copper migration, what method/test are you doing to insure
> that you are giving your customer a good solderable surface. Please
> explain?
> Tony Steinke
> AIT-Atlanta Inc.
> ----- Original Message -----
> From: "Steve Kelly" <[log in to unmask]>
> To: <[log in to unmask]>
> Sent: Wednesday, June 19, 2002 11:13 AM
> Subject: Re: [TN] Immersion Tin
>
>
> > SERA will not help you - it is only a tool to measure tin /copper
> > concentrations . We have been running immersion tin for 5 years with
> no
> > issues but only one thermal excursion is allowed. The tin forms a
> > copper/tin intermetallic after thermal. We even silkscreen before tin
> to
> > eliminate this bake cycle. Regards Steve
> >
> > -----Original Message-----
> > From: TechNet [mailto:[log in to unmask]] On Behalf Of Tempea, Ioan
> > Sent: Wednesday, June 19, 2002 12:07 PM
> > To: [log in to unmask]
> > Subject: Re: [TN] Immersion Tin
> >
> > Hi Tony,
> >
> > we experienced poor wave soldering after 2 reflows with immersion tin.
> > So,
> > please give me a few hints on SERA. Is it a test that the board house
> > will
> > do, or it has to be at our incoming? Does it imply additional charges?
> > Where
> > can I read more?
> >
> > Thanks,
> > Ioan
> >
> > > -----Original Message-----
> > > From: tony steinke [SMTP:[log in to unmask]]
> > > Sent: Wednesday, June 19, 2002 11:19 AM
> > > To: [log in to unmask]
> > > Subject: Re: [TN] Immersion Tin
> > >
> > > Grant,
> > > Having installed the Cookson(Dexter) FST chemistry a couple of
> years
> > > ago at my previous employer, there are concerns that you should be
> > aware
> > > of.
> > > The immersion tin
> > > process is a beautiful thing if applied and processed properly. Some
> > of
> > > the
> > > major
> > > issues that I experienced were:
> > > Solder mask adhesion(you should tape test any incoming product)
> > > Request that SERA(sequential electromigration reduction analysis)
> test
> > be
> > > performed.
> > > And the biggest problem was getting acceptable solderability on
> second
> > > pass
> > > wave solder
> > > or second pass solder paste. The copper migration greatly
> accelerates
> > > during
> > > any thermal
> > > excursion, but that is what the SERA testing will show you.
> > > Tony Steinke
> > > [log in to unmask]
> > >
> > > ----- Original Message -----
> > > From: "Grant Emandien" <[log in to unmask]>
> > > To: <[log in to unmask]>
> > > Sent: Wednesday, June 19, 2002 3:06 AM
> > > Subject: [TN] Immersion Tin
> > >
> > >
> > > > Members,
> > > >
> > > > A PCB supplier has requested us to evaluate immersion tin as a
> > finish.
> > > > Immediate concerns raised were shelf life, solderability,
> whiskers,
> > etc.
> > > > Researching the archives has noted similar as well as opposing
> views
> > and
> > > > concerns. In addition to possible problems arising from immersion
> > tin
> > > > finish, what PCB fabricator process changes may contribute to
> > possible
> > > > reliability and solderability concerns and how this impacts
> > production
> > > > processes such as reflow. The proprietary chemistry used is
> MacStan
> > HSR
> > > from
> > > > Macdermid.
> > > >
> > > > Anyone willing to share experiences and guide me towards making an
> > > informed
> > > > decision.
> > > >
> > > > TIA
> > > > Grant
> > > >
> > > >
> > > >
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