Thanks everybody for the input. Now it's clear to me that mild flux no-clean waving after 2 reflows won't exactly be successful with ImSn. Regards, Ioan > -----Original Message----- > From: Steve Kelly [SMTP:[log in to unmask]] > Sent: Thursday, June 20, 2002 9:24 AM > To: [log in to unmask] > Subject: Re: [TN] Immersion Tin > > 1) we send samples to our chemistry supplier every 3 months to run the > SERA > 2) tight control of the chemistry on the line - actually not very > difficult > 3) after 5 years of running this I can look at the finish and tell with > probably a 99.9% accuracy if it is acceptable > 4) we also do solderability tests > 5) 5 years of 0 field returns > > Regards, Steve Kelly > > -----Original Message----- > From: TechNet [mailto:[log in to unmask]] On Behalf Of tony steinke > Sent: Wednesday, June 19, 2002 6:12 PM > To: [log in to unmask] > Subject: Re: [TN] Immersion Tin > > Steve, > If you do not prefer the SERA testing to measure/evaluate > the amount of copper migration, what method/test are you doing to insure > that you are giving your customer a good solderable surface. Please > explain? > Tony Steinke > AIT-Atlanta Inc. > ----- Original Message ----- > From: "Steve Kelly" <[log in to unmask]> > To: <[log in to unmask]> > Sent: Wednesday, June 19, 2002 11:13 AM > Subject: Re: [TN] Immersion Tin > > > > SERA will not help you - it is only a tool to measure tin /copper > > concentrations . We have been running immersion tin for 5 years with > no > > issues but only one thermal excursion is allowed. The tin forms a > > copper/tin intermetallic after thermal. We even silkscreen before tin > to > > eliminate this bake cycle. Regards Steve > > > > -----Original Message----- > > From: TechNet [mailto:[log in to unmask]] On Behalf Of Tempea, Ioan > > Sent: Wednesday, June 19, 2002 12:07 PM > > To: [log in to unmask] > > Subject: Re: [TN] Immersion Tin > > > > Hi Tony, > > > > we experienced poor wave soldering after 2 reflows with immersion tin. > > So, > > please give me a few hints on SERA. Is it a test that the board house > > will > > do, or it has to be at our incoming? Does it imply additional charges? > > Where > > can I read more? > > > > Thanks, > > Ioan > > > > > -----Original Message----- > > > From: tony steinke [SMTP:[log in to unmask]] > > > Sent: Wednesday, June 19, 2002 11:19 AM > > > To: [log in to unmask] > > > Subject: Re: [TN] Immersion Tin > > > > > > Grant, > > > Having installed the Cookson(Dexter) FST chemistry a couple of > years > > > ago at my previous employer, there are concerns that you should be > > aware > > > of. > > > The immersion tin > > > process is a beautiful thing if applied and processed properly. Some > > of > > > the > > > major > > > issues that I experienced were: > > > Solder mask adhesion(you should tape test any incoming product) > > > Request that SERA(sequential electromigration reduction analysis) > test > > be > > > performed. > > > And the biggest problem was getting acceptable solderability on > second > > > pass > > > wave solder > > > or second pass solder paste. The copper migration greatly > accelerates > > > during > > > any thermal > > > excursion, but that is what the SERA testing will show you. > > > Tony Steinke > > > [log in to unmask] > > > > > > ----- Original Message ----- > > > From: "Grant Emandien" <[log in to unmask]> > > > To: <[log in to unmask]> > > > Sent: Wednesday, June 19, 2002 3:06 AM > > > Subject: [TN] Immersion Tin > > > > > > > > > > Members, > > > > > > > > A PCB supplier has requested us to evaluate immersion tin as a > > finish. > > > > Immediate concerns raised were shelf life, solderability, > whiskers, > > etc. > > > > Researching the archives has noted similar as well as opposing > views > > and > > > > concerns. In addition to possible problems arising from immersion > > tin > > > > finish, what PCB fabricator process changes may contribute to > > possible > > > > reliability and solderability concerns and how this impacts > > production > > > > processes such as reflow. The proprietary chemistry used is > MacStan > > HSR > > > from > > > > Macdermid. > > > > > > > > Anyone willing to share experiences and guide me towards making an > > > informed > > > > decision. > > > > > > > > TIA > > > > Grant > > > > > > > > > > > > > > ********************************************************************** > > > > Notice: > > > > > > > > This email transmission contains confidential information which is > > the > > > property of the sender. The information is intended only for the use > > of > > > the > > > addressee. If you are not the intended recipient, you are hereby > > notified > > > that any disclosure, copying or distribution of the contents of this > > > e-mail > > > transmission, or the taking of any action in reliance thereon or > > pursuant > > > thereto, is strictly prohibited. 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