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May 2002

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Subject:
From:
David White <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 3 May 2002 16:17:33 -0400
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text/plain (69 lines)
Dick,
We are using a connector that you describe, two rows of 5 pins.  We use a
8mil stencil cut 1:1 and it solders fine. IPC does not give a whole lot of
detail as to how much solder fillet or anything, just that the fillet
length along the side be a minimum of the width of the pin (25mils), we get
that easy.  The heal fillet is were you will run into problems. (as you
stated). Our design guys made a note on the drawing  to eliminate
confusion, but we come pretty close to meeting IPC. We are Class 2 thought.
Good luck

David
Ascom Energy
Palm Coast, FL





"Krug, Dick" <[log in to unmask]>@IPC.ORG> on 05/03/2002 10:04:51 AM

Please respond to "TechNet E-Mail Forum." <[log in to unmask]>; Please respond
      to "Krug, Dick" <[log in to unmask]>

Sent by:  TechNet <[log in to unmask]>


To:   [log in to unmask]
cc:
Subject:  [TN] Class 3 Solder Fillets - SMT 25 mil square pin Headers?


We assemble primarily IPC class 3 products.  We have now got some SMT
headers, using 25 mil square pins bent to form a "gull wing" style lead.
There is no way we can get a solder fillet to reach a 25 mil thick lead
thickness.  Can these be assembled to meet Class 3 requirements?  I think
I've seen something indicating a deviation from these requirements, but I
don't know where nor can I find it again.  Any suggestions?

Dick Krug
Sypris Electronics
Tampa, FL
[log in to unmask]

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