Hello Dick,
Since IPC-A-610 and J-STD-001 don't have specific requirements for your
connector, as a starting point IMO, I would look at the requirements for
gull wing leads and inward formed L-shaped ribbon leads instead of flat lug
leads to establish joint feature requirements.  The other consideration is
to evaluate the mechanical strength required to hold the connector in place
during service (in other words, will this specified solder joint geometry
yield a reliable product for its intended use environment).  Hopefully, the
connector will be secured to the substrate using mechanical fasteners and
not rely soley on the solder connections for mechanical integrity.  This
information should then be provided to your customer for approval and then
documented on the assembly drawing or incorporated into your internal
procedures (i.e. workmanship manual).

Steve Sauer
Mfg Engineer
Northrop Grumman, Xetron

-----Original Message-----
From: Krug, Dick [mailto:[log in to unmask]]
Sent: Friday, May 03, 2002 10:05 AM
To: [log in to unmask]
Subject: [TN] Class 3 Solder Fillets - SMT 25 mil square pin Headers?


We assemble primarily IPC class 3 products.  We have now got some SMT
headers, using 25 mil square pins bent to form a "gull wing" style lead.
There is no way we can get a solder fillet to reach a 25 mil thick lead
thickness.  Can these be assembled to meet Class 3 requirements?  I think
I've seen something indicating a deviation from these requirements, but I
don't know where nor can I find it again.  Any suggestions?

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