We assemble primarily IPC class 3 products.  We have now got some SMT
headers, using 25 mil square pins bent to form a "gull wing" style lead.
There is no way we can get a solder fillet to reach a 25 mil thick lead
thickness.  Can these be assembled to meet Class 3 requirements?  I think
I've seen something indicating a deviation from these requirements, but I
don't know where nor can I find it again.  Any suggestions?

Dick Krug
Sypris Electronics
Tampa, FL
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