Björn

There are VP reflow systems with controlled preheating, either using
secondary fluids or IR. It is not necessary to put cold components in
vapour at 215°C or more.

Brian

Björn Kullman wrote:
>
> True about not being able to overheat components, but, consider the fast
> ramp-up that the majority (all?) of vapour phase ovens produce. Components
> sensitive to temperature changes above 4 deg/sec are liable to damage.
>
> Björn Kullman
>
> Sincotron Technology Center, Norrköping, Sweden
> Sincotron Sverige AB                    www.sincotron.se
> phone +46 (0)11-368288 mobile +46 (0)70-4245607
>
> -----Ursprungligt meddelande-----
> Från: TechNet [mailto:[log in to unmask]]För Brian Ellis
> Skickat: den 25 maj 2002 08:06
> Till: [log in to unmask]
> Ämne: Re: [TN] Vapor phase
>
> Mike
>
> It's true that PFCs do dissolve oxygen but the quantity in the vapour
> phase is sufficiently low that no significant oxidation will occur,
> unlike non-controlled atmospheric convection or IR soldering.
> Milder/less flux can be used.
>
> The advantage over convection is that 3-D assmeblies are much easier to
> solder and, being asymptotic, the process is less liable to damage
> components which are very thermally sensitive because it is impossible
> to exceed the vapour temperature which is fixed by the chemical
> composition.
>
> Brian
>
> > Stefano Riccardi wrote:
> >
> > Hi all!
> > We are currently looking for the assembling of a double side SMT - one
> > side THT (High pin count connectors) board, with a lot of BGA.
> > An assembler proposed us the use of vapor Phase reflow soldering.
> > Any comment about this method?
> > Can someone tell me where I can find informations (books, www,
> > publications) about the vapor phase soldering?
> >
> > Thanks!
>
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