The 610C document does not require a fillet to the side of the lead, even
for Class 3.
Remember that Class 3 also allows side overhang and toe overhang. As a
shocking example, Figure 12-71, page 12-46 illustrates an acceptable
condition for all classes. Heel fillets are still required as well as a
properly wetted fillet under the lead.
Call me if I can explain the content further.
Best regards,
Mel Parrish
Director of Training
Soldering Technology International
102 Tribble Drive
Madison, AL 35758
256 705 5530
256 705 5538 Fax
[log in to unmask]
www.solderingtech.com
-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of
[log in to unmask]
Sent: Tuesday, May 21, 2002 12:41 AM
To: [log in to unmask]
Subject: Re: [TN] Side fillet requirements
No side fillets are usually found on fine-pitch QFP's and the like, where
really there isn't the room to have pads wider than the leads without an
attendant risk of solder bridging. If you have a class 2 product, side
fillets aren't an issue. For class 3, we have to grin and bear it. Toe and
Heel fillets are the important fellows when considering solder joint
strength.
Peter
Frank Kimmey <[log in to unmask]> 21/05/2002 06:16 AM
Sent by: TechNet <[log in to unmask]>
Please respond to "TechNet E-Mail Forum."; Please respond to Frank Kimmey
To: [log in to unmask]
cc: (bcc: DUNCAN Peter/Asst Prin Engr/ST Aero/ST Group)
Subject: [TN] Side fillet requirements
I have a customer who would like us to justify why our IPC-782 compliant
footprints do not allow for a side fillet (pad width is equal to or smaller
than lead width). I did not find conclusive statement in IPC-610 concerning
this. Please help me define acceptance.
Thanks,
FNK
Frank N Kimmey, C.I.D.+
Senior PCB Designer
Powerwave Technologies
PH. 916-941-3159
Fax 916-941-3195
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