I have a CM that precision spray coats UR with an x-y programmable gantry
system.  They would like to avoid coating large areas of the board that have
no components but DOES have conductors covered by solder mask over bare
copper. The boards are all Class 3,  4 layers, some designs Tin/lead plate
finish, some solder dipped finish, some .062 thk, some .125 thick.

They are requesting a change of wording on the drawing to read: Coat all
components, leads, solder joints and exposed circuitry per J-Std-001.  Does
anyone have serious concerns with this approach?

Bruce Misner

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