Voiding within specified limits is not a problem as often stated. However,
as a process indicator, you must look at all elements contributing to solder
joint formation and voiding therein.

If "excessive" voiding is apparent or contines, what's contributing to it?
Your profile looks typical for most solder paste brands/types but what else
is there as oxidation or other contamination requiring the paste/flux to
continue the struggle to clean the solder termination area?

MoonMan

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