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May 2002

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From:
Hinners Hans M Civ WRALC/LUGE <[log in to unmask]>
Date:
Tue, 21 May 2002 11:29:37 -0400
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"WEEKES, MICHAEL HS-SNS" <[log in to unmask]>
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"TechNet E-Mail Forum." <[log in to unmask]>, Hinners Hans M Civ WRALC/LUGE <[log in to unmask]>
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Hi Mike,

Sounds like you need to d a little test between bake & no bake and convince
everyone it's okay.  We had to do that on the bare board side to stop the
debate.

Hans

-----Original Message-----
From: WEEKES, MICHAEL HS-SNS [mailto:[log in to unmask]]
Sent: Tuesday, May 21, 2002 10:16 AM
To: [log in to unmask]
Subject: [TN] board baking


Years ago, at Raytheon , we used to bake PWBs prior to soldering.  Over 18
yrs I have seen this trend fade away and good riddance, too.

I recently joined a company who maintains board bake - manufacturing hates
it, but there is one very legitimate expert who still promotes it.  I'm
looking for help / evidence or reports/data that justify the elimination of
this non-value added step.  I thought, especially after attending a great
IPC session by mike Carano, that if boards are properly fabricated and
sealed, air tight in a bag, prior to shipment to the user (soldering
company/assembly house) they'd be good, as long as they remain bagged up to
point of use.

please offer suggestions/solutions.

thanks,
Mike`

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