Hello-

As we know both thermal cycling test and RS vibration test in HALT (Highly
Accerlated Life Test) are effective in detecting solder joint related
failures.
Right now we are in the process of developing HASS profile, can someone help
me on fllowing questions?

(1)Which test is more efficient, thermal cycling or RS Vibration?
(2) how to correlate number of cycles of test (either thermal cycling or
vibration) with service time in the field application?

Thanks for your time.

Mary
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