Hello- As we know both thermal cycling test and RS vibration test in HALT (Highly Accerlated Life Test) are effective in detecting solder joint related failures. Right now we are in the process of developing HASS profile, can someone help me on fllowing questions? (1)Which test is more efficient, thermal cycling or RS Vibration? (2) how to correlate number of cycles of test (either thermal cycling or vibration) with service time in the field application? Thanks for your time. Mary _________________________________________________________________________ Live, laugh, and chat with friends about BMWs, Porsches, Jaguars and the new MINI at The World's Largest Auto Enthusiast Site http://www.roadfly.org/ --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/scripts/wa.exe?S1=technet Please visit IPC web site http://www.ipc.org/html/forum.htm for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------