Two pics up. One showing the SMT site half wetted with what looks like
normal gold considering the thousands or so I've seen. Never had this
problem before but for black pad. This ain't that, of course. This situation
is not in any way related to thermal plane connections.

The through hole stuff looks a little flakey. Don't know about the thermal
connections but possible though contamination is my first guess.

Did the solder paste print and reflow sample and it looked acceptable.
Design sucks but did not interfere, so far, with solderability.

Anxiously awaiting final product/solder joint quality. Keep you all posted.

Kathy, did you get my ramblings about management worker stuff?

MoonMan

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